| 摘要 |
Disclosed is a flexible and tough solder resist composition that is particularly used for an alkali-developable printed wiring board. Specifically disclosed is a photosensitive resin composition for an alkali-developable printed wiring board, which is characterized by comprising (A) a carboxyl-containing urethane resin having a biphenyl novolac structure and (B) a photopolymerization initiator. |
