发明名称
摘要 The present invention provides a water-soluble resin composition which can be used as a light-proofness protecting film arranged between an organic semiconductor film and an interlayer insulating film. The light-proofness protecting film can prevent the crystallinity of the organic electrical components from reducing when the organic semiconductor film of the organic electrical component contact with the interlayer insulating film, besides, the light-proofness protecting film also can solve the problem that the interlayer insulating film is photo-oxidized when exposed to light. The present invention relates to a light-proofness water-soluble resin composition, particular to a light-proofness water-soluble resin composition containing : a) water-soluble resin, b) water-soluble dye compound, c) solvents ,and the light-proofness water-soluble resin composition is used as protecting films for organic semiconductors.
申请公布号 JP5538689(B2) 申请公布日期 2014.07.02
申请号 JP20080148693 申请日期 2008.06.06
申请人 发明人
分类号 H01L29/786;C08K5/00;C08L101/14;C09D5/00;H01L21/312;H01L21/336;H01L51/05 主分类号 H01L29/786
代理机构 代理人
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