| 摘要 |
A high strength and high thermal conductivity copper alloy tube contains: Co of 0.12 to 0.32 mass%; P of 0.042 to 0.095 mass%; and Sn of 0.005 to 0.30 mass%, wherein a relationship of 3.0 ‰¤ ([Co]-0.007)/([P]-0.008) ‰¤ 6.2 is satisfied between a content [Co] mass% of Co and a content [P] mass% of P, and the remainder includes Cu and inevitable impurities. Even when a temperature is increased by heat generated by a drawing process, a recrystallization temperature is increased by uniform precipitation of a compound of Co and P and by solid-solution of Sn. Thus, the generation of recrystallization nucleuses is delayed, thereby improving heat resistance and pressure resistance of the high strength and high thermal conductivity copper alloy tube. |
