| 摘要 |
<p>The present invention provides a package on package device, including: at least two components, sequentially soldered with each other, where a size of a base plate of a component located below is greater than a size of an edge of a component located above. In the package on package device provided by the present invention, the size of the base plate of the component located below is greater than the size of the edge of the component located above, so as to ensure that performing glue dispensing on the base plate of the component located below fastens the component located above, so that stability of the component located above is ensured.</p> |
