发明名称 |
Field-effect semiconductor device having a trench gate electrode and method of making the same |
摘要 |
<p>In a semiconductor device, a p-type base region (2) is provided in an n - -type substrate (1) to extend from a principal surface (1a) of the substrate in a perpendicular direction to the principal surface. An n + -type source region (3) extends in the p-type base region from the principal surface in the perpendicular direction, and an n + -type drain region (4) extends in the substrate separately from the p-type base region with a drift region (1c) interposed therebetween. A trench (5) is formed to penetrate the p-type base region from the n + -type source region in a direction (Y) parallel to the principal surface. A gate electrode (7) is formed in the trench through a gate insulating film (6). Accordingly, a channel region can be formed with a channel width in a depth direction of the trench when a voltage is applied to the gate electrode.</p> |
申请公布号 |
EP1094525(B1) |
申请公布日期 |
2014.07.02 |
申请号 |
EP20000122616 |
申请日期 |
2000.10.17 |
申请人 |
DENSO CORPORATION |
发明人 |
YAMAGUCHI, HITOSHI;SAKAKIBARA, TOSHIO;SAKAKIBARA, JUN;SHIBATA, TAKUMI;MORISHITA, TOSHIYUKI |
分类号 |
H01L29/74;H01L29/78;H01L21/331;H01L21/332;H01L21/336;H01L21/76;H01L27/088;H01L29/04;H01L29/06;H01L29/417;H01L29/423;H01L29/739;H01L29/749;H01L29/786 |
主分类号 |
H01L29/74 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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