| 摘要 |
<p>The present invention provides a laminated semiconductor package by using an interposer, which includes: a main substrate; an interposer which is arranged on the main substrate and includes a multi-cavity which is provided at the center of the top surface of the interposer and has upper and lower portions different from each other in size; a first semiconductor package arranged in the lower side of the multi-cavity of the interposer; and a plurality of second semiconductor packages laminated on the upper side of the multi-cavity on the first semiconductor package. According to the present invention, the multi-cavity is formed in the silicon interposer, thereby minimizing the product without an additional space or the difficulty of the RDL when at least two types of semiconductor chips are laminated on the interposer instead of the same semiconductor chip.</p> |
