| 发明名称 |
Electrically conductive paste composition |
| 摘要 |
An electrically conductive paste composition comprises: (a) silver powders comprising spherical silver powders having a mean particle size (D50) of over 0.1 μm and no more than 5 μm and flake-shaped silver powders having a mean particle size of no more than 10 μm; and (b) binder resins comprise (b-1) aliphatic thermoplastic resin and (b-2) self-polymerizing thermosetting resin; wherein the content of the silver powders is no more than 60 wt % based on the total weight of the paste composition, wherein the weight ratio of the aliphatic thermoplastic resin for the self-polymerizing thermosetting resin ((b-1)/(b-2)) is 99/1-67/33 and wherein the weight ratio of the silver powders for the binder resins ((a)/(b)) is 94/6-85/15. |
| 申请公布号 |
US8767378(B2) |
申请公布日期 |
2014.07.01 |
| 申请号 |
US201213667563 |
申请日期 |
2012.11.02 |
| 申请人 |
E I du Pont de Nemours and Company |
发明人 |
Ogiwara Toshiaki |
| 分类号 |
H01G9/00 |
主分类号 |
H01G9/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electrically conductive paste composition comprises:
(a) silver powders comprising spherical silver powders having a mean particle size (D50) of over 0.1 μm and no more than 5 μm and flake-shaped silver powders having a mean particle size (D50) of no more than 10 μm; and (b) binder resins comprise (b-1) aliphatic thermoplastic resin and (b-2) self-polymerizing thermosetting resin;
wherein the content of the silver powders is no more than 60 wt % based on the total weight of the paste composition, wherein the weight ratio of the aliphatic thermoplastic resin for the self-polymerizing thermosetting resin ((b-1)/(b-2)) is 99/1-67/33 and wherein the weight ratio of the silver powders for the binder resins ((a)/(b)) is 94/6-85/15. |
| 地址 |
Wilmington DE US |
