Light-emitting diode arrangement with heat dissipating plate

摘要

The invention relates to a light-emitting arrangement, having:—at least one light-emitting diode chip (1),—a multi-layer board (17) having a base (5) of a thermally well conducting material, in particular of metal, and—an electrical insulating and thermally conducting connection layer (2) between the emission surface of the light-diode chip (1) and the board (17).

主权项

1. A light-emitting diode arrangement, comprising:
a light-emitting diode chip; a multi-layer board having a base layer of a thermally well-conducting material, the material including a metal, the base layer being a core of the board and configured for heat dissipation; an intermediate carrier separate from the light-emitting diode; and an electrically insulating and thermally conducting connection layer arranged directly on the base layer of the multi-layer board, the intermediate carrier being arranged over the electrically insulating and thermally conducting connection layer, and wherein there is no electrically conducting layer between one opposing surface of the intermediate carrier and one opposing surface of the electrically insulating and thermally conducting connection layer, and wherein the base layer is a farthest one of a plurality of layers of the multi-layer board from the light-emitting diode chip.