发明名称 |
Heat-resistant resin paste and method for producing same |
摘要 |
An object of the present invention is to provide a heat-resistant resin paste that enables the formation of a precise pattern, exhibits excellent adhesiveness, heat resistance and flexibility, and enables a shortening of the production time, as well as a method for producing thereof. The present invention relates to a heat-resistant resin paste, comprising a first organic solvent (A1), a second organic solvent (A2) that comprises a lactone, a heat-resistant resin (B) that is soluble in a mixed organic solvent of (A1) and (A2), and a heat-resistant resin filler (C) that is soluble in (A1) but insoluble in (A2), wherein (C) is dispersed within a solution comprising (A1), (A2) and (B). |
申请公布号 |
US8765867(B2) |
申请公布日期 |
2014.07.01 |
申请号 |
US200411573959 |
申请日期 |
2004.09.28 |
申请人 |
Hitachi Chemical Company, Ltd. |
发明人 |
Kawakami Hiroyuki;Yamaguchi Reiko;Nomura Yoshihiro |
分类号 |
C08G69/26;C08K5/00;C08L77/00 |
主分类号 |
C08G69/26 |
代理机构 |
Antonelli, Terry, Stout & Kraus, LLP. |
代理人 |
Antonelli, Terry, Stout & Kraus, LLP. |
主权项 |
1. A heat-resistant resin paste, comprising:
a first organic solvent (A1), wherein the first organic solvent is 1,3-dimethyl-3,4,5,6-tetrahydro-2(1H)-pyrimidinone, a second organic solvent (A2) that comprises a lactone, wherein the lactone is selected from the group consisting of γ-butyrolactone and γ-valerolactone, a heat-resistant resin (B) that is soluble in a mixed organic solvent of (A1) and (A2), and a heat-resistant resin filler (C) that is soluble in (A1) but insoluble in (A2), wherein (C) is dispersed within a solution comprising (A1), (A2) and (B), a quantity of the lactone, relative to a total weight of the second organic solvent (A2), is at least 5% by weight, a quantity of the heat-resistant resin (B) and the heat-resistant resin filler (C), relative to a total weight of the heat-resistant resin paste, is within a range from 5 to 90% by weight, the heat-resistant resin (B) comprises a polyimide resin, a polyamideimide resin, a polyamide resin, or a precursor thereto, and the heat-resistant resin filler (C) comprises a polyimide resin, a polyamideimide resin, a polyamide resin, or a precursor thereto. |
地址 |
Tokyo JP |