| 发明名称 |
Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement |
| 摘要 |
A method for manufacturing a metal pad structure of a die is provided, the method including: forming a metal pad between encapsulation material of the die, wherein the metal pad and the encapsulation material are separated from each other by a gap; and forming additional material in the gap to narrow at least a part of the gap. |
| 申请公布号 |
US8765531(B2) |
申请公布日期 |
2014.07.01 |
| 申请号 |
US201213590218 |
申请日期 |
2012.08.21 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Gatterbauer Johann;Weidgans Bernhard;Busch Joerg |
| 分类号 |
H01L21/00;H01L23/48;H01L23/00;H01L23/498 |
主分类号 |
H01L21/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a metal pad structure of a die, the method comprising:
forming a metal pad between encapsulation material of the die, wherein the metal pad and the encapsulation material are separated from each other by a gap; and forming additional material in the gap to narrow at least a part of the gap, wherein forming the additional material in the gap comprises adhering the additional material to one or more sidewalls of the encapsulation material. |
| 地址 |
Neubiberg DE |
