Method of manufacturing an integrated circuit packaging system including lasering through encapsulant over interposer

摘要

A method of manufacture of an integrated packaging system includes: providing a substrate; mounting an integrated circuit on the substrate; mounting an interposer substrate having an interposer pad on the integrated circuit; covering an encapsulant over the integrated circuit and the interposer substrate; forming a hole through the encapsulant aligned over the interposer pad; and placing a conductive connector on and in direct contact with the interposer pad.

主权项

1. A method of manufacture of an integrated circuit packaging system comprising:
providing a substrate; mounting an integrated circuit on the substrate; mounting an interposer substrate having an interposer pad on the integrated circuit; covering an encapsulant over the integrated circuit and the interposer substrate; forming a hole through the encapsulant aligned over the interposer pad including lasering through the encapsulant simultaneously at different locations aligned over interposer pads to form holes having different sizes; and placing a conductive connector on and in direct contact with the interposer pad, a top of the conductive connector laterally spaced away from a side of the hole.