Integrated circuit including interconnect levels

摘要

An integrated circuit as described herein includes an upper interconnect level including a continuous upper interconnect area, the continuous upper interconnect area including a plurality of upper contact openings. The integrated circuit further includes a lower interconnect level including a continuous lower interconnect area, the continuous lower interconnect area including a plurality of lower contact openings. First contacts extend through the lower contact openings to the upper interconnect area and second contact openings extend through the upper contact openings to the lower interconnect area.

主权项

1. An integrated circuit, comprising:
an upper interconnect level including a continuous upper interconnect area, the continuous upper interconnect area including a plurality of upper contact openings arranged along first and second lateral directions in a pattern; a lower interconnect level including a continuous lower interconnect area, the continuous lower interconnect area including a plurality of lower contact openings arranged along first and second lateral directions in a pattern; first contacts extending through the lower contact openings to the upper interconnect area; and second contacts extending through the upper contact openings to the lower interconnect area; wherein the upper interconnect area is electrically coupled to a plurality of first conductive lines of an interconnect level arranged below the lower interconnect level and the lower interconnect area is electrically coupled to a plurality of second conductive lines of the interconnect level arranged below the lower interconnect level, the first and second conductive lines being alternately arranged to one another.