Polyphenylene sulfide resin composition with improved thermal conductivity and surface appearance and articles thereof

摘要

A polyphenylene sulfide resin composition comprises (A) about 30 to about 50% by weight of a polyphenylene sulfide resin; (B) about 1 to about 5% by weight of an amorphous polyamide resin; and (C) about 45 to about 69% by weight thermally conductive insulating fillers.

主权项

1. A polyphenylene sulfide resin composition comprising:
(A) about 30 to about 50 wt % of a polyphenylene sulfide resin; (B) about 1 to about 5 wt % of an amorphous polyamide resin; and (C) about 45 to about 69 wt % of thermally conductive insulating fillers including spherical thermally conductive insulating fillers (c1), wherein the spherical thermally conductive insulating fillers (c1) include magnesium oxide (MgO), alumina (Al2O3), aluminum nitride (AlN) or a combination thereof, and wherein the thermally conductive insulating fillers optionally include plate-shaped thermally conductive insulating fillers (c2).