发明名称 Piezoelectric device
摘要 The piezoelectric device (100) stores a piezoelectric vibrating piece (10) which vibrates whenever an electrical voltage is applied. The piezoelectric device comprises: a package lid (11) having a first peripheral surface (M1) which surrounds a plane surface in a predetermined width; and a package base (12) comprising a second peripheral surface (M2) bonded to the first peripheral surface of the package lid and a recess portion recessed from the second peripheral surface. The first peripheral surface of the package lid and the second peripheral surface of the package base are rough surfaces, respective metal films (AC1, AC2) are formed on each rough surface, and the package lid and the package base are bonded using a sealing material (LG) formed between the metal films.
申请公布号 US8766513(B2) 申请公布日期 2014.07.01
申请号 US201113246141 申请日期 2011.09.27
申请人 Nihon Dempa Kogyo Co., Ltd. 发明人 Mizusawa Shuichi
分类号 H01L41/047 主分类号 H01L41/047
代理机构 Alix, Yale & Ristas, LLP 代理人 Alix, Yale & Ristas, LLP
主权项 1. A piezoelectric device, comprising: a piezoelectric frame having a piezoelectric vibrating piece that vibrates when electrically energized and an outer frame including a first principal surface and a second principal surface formed as to surround the piezoelectric vibrating piece; a package lid having a first peripheral surface that is bonded to the first principal surface of the outer frame of the piezoelectric frame; and a package base having a second peripheral surface that is bonded to the second principal surface of the outer frame of the piezoelectric frame; wherein at least one of the first principal surface of the outer frame or the first peripheral surface of the package lid, and at least one of the second principal surface of the outer frame or the second peripheral surface of the package base has a rough surface; a metal film is formed on the rough surface; and the package lid and the outer frame, and the outer frame and the package base are bonded using a sealing material formed between metal films formed at least one of the package lid, the package base or the outer frame; wherein, a pair of first castellations are formed on opposite peripheral edges of the outer frame of the piezoelectric frame, and a pair of second castellations are formed on opposite peripheral edges of the package base in positions that correspond to the respective first castellations while bonding the piezoelectric frame and the package base; the piezoelectric frame comprises: a pair of excitation electrodes formed on the first principal surface and the second principal surface of the piezoelectric vibrating piece; a first extraction electrode on the first principal surface extending from the excitation electrode on the first principal surface to the first castellation; a second extraction electrode on the second principal surface extending from the excitation electrode on the second principal surface to the first castellation; and a first side surface electrode that is electrically connected to the first extraction electrode and formed on the first castellation; wherein the package base comprises a pair of second side surface electrodes that is electrically connected to the first side surface electrode or the second extraction electrode and formed on the pair of second castellations; and wherein a pair of connecting electrodes is formed on the first castellations and the second castellations, which electrically connects the first side surface electrode or the first extraction electrode to the second side surface electrode.
地址 Tokyo JP