High selectivity nitride etch process

摘要

An anisotropic silicon nitride etch provides selectivity to silicon and silicon oxide by forming a fluorohydrocarbon-containing polymer on silicon surfaces and silicon oxide surfaces. Selective fluorohydrocarbon deposition is employed to provide selectivity to non-nitride surfaces. The fluorohydrocarbon-containing polymer interacts with silicon nitride to form a volatile compound, thereby enabling etching of silicon nitride. The fluorohydrocarbon-containing polymer interacts with silicon oxide at a low reaction rate, retarding, or completely stopping, the etching of silicon oxide. The fluorohydrocarbon-containing polymer does not interact with silicon, and protects silicon from the plasma. The anisotropic silicon nitride etch can be employed to etch silicon nitride selective to silicon and silicon oxide in any dimension, including small dimensions less than 50 nm.

主权项

1. A method of forming a semiconductor structure comprising:
forming a shallow trench isolation structure comprising silicon oxide within a semiconductor material portion in a semiconductor substrate; forming a gate stack on said semiconductor material portion; forming a silicon nitride layer on said gate stack, said semiconductor material portion, and said shallow trench isolation structure; and anisotropically etching said silicon nitride layer to form a silicon nitride spacer laterally surrounding said gate stack, wherein a top surface of said shallow trench isolation structure and a top surface of said semiconductor material portion are physically exposed and subsequently recessed during said anisotropic etching, and a first recess distance by which a top surface of said semiconductor material portion is recessed after physical exposure of said top surface of said semiconductor material portion is less than a second recess distance by which a top surface of said shallow trench isolation structure is recessed after said physical exposure of said top surface of said semiconductor material portion, and is less than a third recess distance by which a top surface of said silicon nitride spacer is recessed after said physical exposure of said top surface of said semiconductor material portion.