Method for manufacturing LED package

摘要

A method for manufacturing an LED package includes following steps. A plate is provided. The plate defines a plurality of the through holes extending from an upper surface to a bottom surface of the plate. A blue film is attached to the bottom surface of the plate and covers openings of the through holes. The blue film and an inner wall of the plate defining the through hole cooperatively define a groove. Glue doped with phosphor particle is injected into the groove. The phosphor particles are condensed to a bottom surface of the glue adjacent to the blue film. The LED chips are embedded in the grooves and positioned at upper ends of the grooves. Finally, the blue film is removed and the plate is severed to obtain a plurality of individual LED packages each including a corresponding LED chip.

主权项

1. A method for manufacturing an LED package, comprising following steps:
providing a plate having an upper surface and a bottom surface, the plate defining a plurality of through holes extending from the upper surface to the bottom surface of the plate, each of the through holes having a first opening in the upper surface and a second opening in the bottom surface; attaching a blue film to the bottom surface of the plate, the blue film covering the second openings of the through holes and cooperatively defining a groove with an inner wall of the plate defining each of the through holes, the groove being communicated with an outer environment through the first opening; injecting a glue into the groove through the first opening, the glue being doped with phosphor particles; condensing the phosphor particles to a bottom surface of the glue adjacent to the blue film; embedding an LED chip in the groove, the LED chip being positioned at an upper end of the groove; and removing the blue film and severing the plate to obtain a plurality of individual LED packages.