| 发明名称 | Package carrier | ||
| 摘要 | A package carrier includes a metal substrate, a pad, a dielectric layer, and a circuit layer. The metal substrate has a first surface and a second surface opposite to the first surface. The pad is disposed on the first surface. The dielectric layer is disposed on the first surface and covers the pad. A thickness of the dielectric layer is less than 150 μm. The circuit layer is embedded in the dielectric layer and connected to the pads. | ||
| 申请公布号 | US8766463(B2) | 申请公布日期 | 2014.07.01 |
| 申请号 | US201213584784 | 申请日期 | 2012.08.13 |
| 申请人 | Subtron Technology Co., Ltd. | 发明人 | Sun Shih-Hao |
| 分类号 | H01L23/48;H01L23/52;H01L29/40 | 主分类号 | H01L23/48 |
| 代理机构 | Jianq Chyun IP Office | 代理人 | Jianq Chyun IP Office |
| 主权项 | 1. A package carrier comprising: a metal substrate having a first surface and a second surface opposite to the first surface; a pad disposed on the first surface; a first dielectric layer disposed on the first surface and covering the pad, a thickness of the first dielectric layer being less than 150 μm, wherein the pad is embedded in the first dielectric layer; and a first circuit layer embedded in the first dielectric layer and connected to the pad. | ||
| 地址 | Hsinchu County TW | ||