| 发明名称 | Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device bonded by the same | ||
| 摘要 | An anisotropic conductive film composition for bonding an electronic device may include a hydrogenated bisphenol A epoxy monomer represented by Formula 1 or a hydrogenated bisphenol A epoxy oligomer represented by Formula 2:;where n may be an integer from 1 to about 50. | ||
| 申请公布号 | US8766443(B2) | 申请公布日期 | 2014.07.01 |
| 申请号 | US201213710728 | 申请日期 | 2012.12.11 |
| 申请人 | Cheil Industries, Inc. | 发明人 | Yu Arum;Kim Nam Ju;Park Kyoung Soo;Park Young Woo;Seo Joon Mo;Sul Kyung Il;Uh Dong Seon;Choi Hyun Min |
| 分类号 | H01L23/48 | 主分类号 | H01L23/48 |
| 代理机构 | Lee & Morse, P.C. | 代理人 | Lee & Morse, P.C. |
| 主权项 | 1. A semiconductor device bonded by an anisotropic conductive film composition, the anisotropic conductive film composition comprising: a first component that includes one or more selected from the group of a hydrogenated bisphenol A epoxy monomer represented by Formula 1 and a hydrogenated bisphenol A epoxy oligomer represented by Formula 2: wherein n is an integer from 1 to about 50; a sulfonium curing agent; a binder resin; and conductive particles. | ||
| 地址 | Gumi-si, Kyeongsangbuk-do KR | ||