发明名称 Memory devices with a connecting region having a band gap lower than a band gap of a body region
摘要 Memory devices are shown that include a body region and a connecting region that is formed from a semiconductor with a lower band gap than the body region. Connecting region configurations can provide increased gate induced drain leakage during an erase operation. Configurations shown can provide a reliable bias to a body region for memory operations such as erasing, and containment of charge in the body region during a boost operation.
申请公布号 US8766320(B2) 申请公布日期 2014.07.01
申请号 US201313872762 申请日期 2013.04.29
申请人 Micron Technology, Inc. 发明人 Liu Haitao;Li Jian;Mouli Chandra
分类号 H01L29/66 主分类号 H01L29/66
代理机构 Schwegman, Lundberg & Woessner, P.A. 代理人 Schwegman, Lundberg & Woessner, P.A.
主权项 1. A memory device, comprising: a doped silicon body region; a source region coupled to a first end of the doped silicon body region, and a drain region coupled to a second end of the doped silicon body region; a plurality of gates along a length of the body region, each of the plurality of gates being separated from the doped silicon body region by a dielectric; a silicon germanium connecting region coupling the source region to the doped silicon body region; and a source select gate adjacent to the doped silicon body region and the silicon germanium connecting region.
地址 Boise ID US