发明名称 |
Memory devices with a connecting region having a band gap lower than a band gap of a body region |
摘要 |
Memory devices are shown that include a body region and a connecting region that is formed from a semiconductor with a lower band gap than the body region. Connecting region configurations can provide increased gate induced drain leakage during an erase operation. Configurations shown can provide a reliable bias to a body region for memory operations such as erasing, and containment of charge in the body region during a boost operation. |
申请公布号 |
US8766320(B2) |
申请公布日期 |
2014.07.01 |
申请号 |
US201313872762 |
申请日期 |
2013.04.29 |
申请人 |
Micron Technology, Inc. |
发明人 |
Liu Haitao;Li Jian;Mouli Chandra |
分类号 |
H01L29/66 |
主分类号 |
H01L29/66 |
代理机构 |
Schwegman, Lundberg & Woessner, P.A. |
代理人 |
Schwegman, Lundberg & Woessner, P.A. |
主权项 |
1. A memory device, comprising:
a doped silicon body region; a source region coupled to a first end of the doped silicon body region, and a drain region coupled to a second end of the doped silicon body region; a plurality of gates along a length of the body region, each of the plurality of gates being separated from the doped silicon body region by a dielectric; a silicon germanium connecting region coupling the source region to the doped silicon body region; and a source select gate adjacent to the doped silicon body region and the silicon germanium connecting region. |
地址 |
Boise ID US |