| 摘要 |
Disclosed are a printed circuit board and a manufacturing method thereof. According to one aspect of the present invention, provided is a printed circuit board which includes a substrate, a pad which is formed on the substrate, a solder resist layer which is formed on the substrate and includes an opening part to expose the pad, and a protrusive pattern which is formed on the pad to protrude to a solder ball received in the opening part. |
