发明名称 |
RESIN COMPOSITION FOR DISSIPATING HEAT, AND RADIATING SUBSTRATE MANUFACTURED USING THE SAME |
摘要 |
The present invention relates to a resin composition for dissipating heat. The resin composition for dissipating heat according to an embodiment of the present invention includes an insulating material, a first filler added in the insulating material and including a plate shape carbon material, and a second filler added in the insulating material and including a carbon material having higher aspect ratio than the first filler. |
申请公布号 |
KR20140081327(A) |
申请公布日期 |
2014.07.01 |
申请号 |
KR20120150948 |
申请日期 |
2012.12.21 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM, KI SEOK;LEE, HWA YOUNG;SHIM, JI HYE |
分类号 |
C08L63/00;C08K3/04;C09K5/00;H05K7/20 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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