发明名称 RESIN COMPOSITION FOR DISSIPATING HEAT, AND RADIATING SUBSTRATE MANUFACTURED USING THE SAME
摘要 The present invention relates to a resin composition for dissipating heat. The resin composition for dissipating heat according to an embodiment of the present invention includes an insulating material, a first filler added in the insulating material and including a plate shape carbon material, and a second filler added in the insulating material and including a carbon material having higher aspect ratio than the first filler.
申请公布号 KR20140081327(A) 申请公布日期 2014.07.01
申请号 KR20120150948 申请日期 2012.12.21
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, KI SEOK;LEE, HWA YOUNG;SHIM, JI HYE
分类号 C08L63/00;C08K3/04;C09K5/00;H05K7/20 主分类号 C08L63/00
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