| 摘要 |
The present invention relates to a heat sink of a semiconductor device and, more particularly, to a heat sink of a semiconductor device capable of quickly discharging heat generated from the semiconductor device through the heat sink. The present invention relates to the heat sink of the semiconductor device which is installed in a computer device and cools the heat generated from the semiconductor device. The semiconductor device is closely fixed to a substrate and a case of the computer device and the heat generated from the semiconductor device is discharged through the case of the computer device. |
