发明名称 |
Semiconductor substrate, electrode forming method, and solar cell fabricating method |
摘要 |
A semiconductor substrate having an electrode formed thereon, the electrode including at least silver and glass frit, the electrode including: a multi-layered structure with a first electrode layer joined directly to the semiconductor substrate, and an upper electrode layer formed of at least one layer and disposed on the first electrode layer. The upper electrode layer is formed by firing a conductive paste having a total silver content of 75 wt % or more and 95 wt % or less, the content of silver particles having an average particle diameter of 4 μm or greater and 8 μm or smaller with respect to the total silver content in the upper electrode layer being higher than that in the first electrode layer. |
申请公布号 |
US8766089(B2) |
申请公布日期 |
2014.07.01 |
申请号 |
US201213559813 |
申请日期 |
2012.07.27 |
申请人 |
Shin-Etsu Handotai Co., Ltd.;Shin-Etsu Chemical Co., Ltd. |
发明人 |
Ishikawa Naoki;Ojima Satoyuki;Ohtsuka Hiroyuki;Watabe Takenori;Saisu Shigenori;Ueguri Toyohiro |
分类号 |
H01L31/00;H05K3/24;H01L31/0224 |
主分类号 |
H01L31/00 |
代理机构 |
Oliff PLC |
代理人 |
Oliff PLC |
主权项 |
1. A method for forming an electrode having a multi-layered structure on a semiconductor substrate by screen-printing by using a plurality of conductive pastes including at least silver powder, glass frit, an organic vehicle, and an organic solvent, the method comprising:
forming a first electrode layer joined directly to the semiconductor substrate, the conductive paste of the first electrode layer containing silver; and forming an upper electrode layer constituted of at least one layer on the first electrode layer, the conductive paste of the upper electrode layer having a total silver content of 75 wt% or more and 95 wt% or less, wherein: a content of silver particles having an average particle diameter of 4 μm or greater and 8 μm or smaller with respect to the total silver content in the conductive paste of the upper electrode layer is greater than the conductive paste of the first electrode layer; and the first electrode layer and the upper electrode layer are formed to have a same footprint. |
地址 |
Tokyo JP |