发明名称 | Method of manufacturing a base substrate for a semi-conductor on insulator type substrate | ||
摘要 | A method and system are provided for manufacturing a base substrate that is used in manufacturing a semi-conductor on insulator type substrate. The base substrate may be manufactured by providing a silicon substrate having an electrical resistivity above 500 Ohm·cm; cleaning the silicon substrate so as to remove native oxide and dopants from a surface thereof; forming, on the silicon substrate, a layer of dielectric material; and forming, on the layer of dielectric material, a layer of poly-crystalline silicon. These actions are implemented successively in an enclosure. | ||
申请公布号 | US8765571(B2) | 申请公布日期 | 2014.07.01 |
申请号 | US201213426190 | 申请日期 | 2012.03.21 |
申请人 | Soitec | 发明人 | Kononchuk Oleg;Allibert Frederic |
分类号 | H01L21/76 | 主分类号 | H01L21/76 |
代理机构 | TraskBritt | 代理人 | TraskBritt |
主权项 | 1. A method of manufacturing a high resistivity base substrate, which comprises: (a) providing a silicon substrate having an electrical resistivity above 500 Ohm·cm, (b) cleaning the silicon substrate so as to remove native oxide and dopants from a surface thereof, providing, on the silicon substrate, a layer of dielectric material, (d) providing, on the layer of dielectric material, a layer of poly-crystalline silicon, and implementing steps (b), (c) and (d) successively in the same enclosure to minimize loss of resistivity of the poly-crystalline layer of the substrate. | ||
地址 | Bernin FR |