Fabrication of field effect devices using spacers

摘要

A method for forming a field effect device includes forming a gate portion on a silicon-on-insulator layer (SOI), forming first spacer members on the SOI layer adjacent to the gate portion, depositing a layer of spacer material on the SOI layer, the first spacer members, and the gate portion, removing portions of the layer of spacer material to form second spacer members on the SOI layer adjacent to the first spacer members, forming a source region and a drain region on the SOI layer by implanting ions in the SOI layer, and etching to remove the second spacer members.

主权项

1. A method for forming a field effect device comprising:
forming a gate portion on a silicon-on-insulator layer (SOI); forming first spacer members on the SOI layer adjacent to the gate portion; depositing a layer of spacer material on the SOI layer, the first spacer members, and the gate portion; removing portions of the layer of spacer material to form second spacer members on the SOI layer adjacent to the first spacer members; forming a source region and a drain region on the SOI layer by implanting ions in the SOI layer, wherein the first spacer members and the second spacer members prevent implanting of ions in regions of the SOI layer that are masked by the first spacer members and the second spacer members; epitaxially growing silicon material on the source and drain regions and adjacent to the first spacer members; etching to remove the second spacer members and the first spacer members; forming third spacer members adjacent to the gate portion and at least partially disposed on a portion of the epitaxially grown silicon material disposed on the source and drain regions, and forming a silicide material on the source region, the drain region, and the gate portion after the formation of the third spacer; wherein the first spacer members are removed after epitaxially growing silicon material on the source and drain regions and the second spacer members are removed prior to epitaxially growing silicon material on the source and drain regions.