Wiring board with built-in semiconductor element

摘要

A wiring board including a built-in semiconductor element includes the semiconductor element, a peripheral insulating layer covering an outer peripheral side surface of the semiconductor element, an upper surface-side wiring provided on an upper surface side of the wiring board, and a lower surface-side wiring provided on a lower surface side of the wiring board. The semiconductor element includes a first wiring structure layer including a first wiring and a first insulating layer alternately provided on a semiconductor substrate, and a second wiring structure layer including a second wiring and a second insulating layer alternately provided on the first wiring structure layer. The upper surface-side wiring includes a wiring electrically connected to the first wiring via the second wiring. The second wiring is thicker than the first wiring and thinner than the upper surface-side wiring. The second insulating layer is formed of a resin material and is thicker than the first insulating layer.

主权项

1. A wiring board including a built-in semiconductor element, the wiring board comprising:
the semiconductor element; a peripheral insulating layer covering at least an outer peripheral side surface of the semiconductor element; an upper surface-side wiring provided on an upper surface side of the wiring board; and a lower surface-side wiring provided on a lower surface side of the wiring board, wherein the semiconductor element comprises:
a semiconductor substrate;a first wiring structure layer including a first wiring and a first insulating layer alternately provided on the semiconductor substrate; anda second wiring structure layer including a second wiring and a second insulating layer alternately provided on the first wiring structure layer, the upper surface-side wiring includes a wiring electrically connected to the first wiring via the second wiring, the second wiring is thicker than the first wiring and thinner than the upper surface-side wiring, the second insulating layer is formed of a resin material and is thicker than the first insulating layer, and an outer peripheral side surface of the second wiring structure layer is located inside an outer edge of an upper surface of the first wiring structure layer, the outer peripheral side surface of the second wiring structure layer including an outer peripheral side surface of a lowermost layer-side second insulating layer of the second wiring structure layer, wherein an outer edge of a lower surface of the lowermost layer-side second insulating layer is located inside the outer edge of the upper surface of the first wiring structure layer.