Semiconductor module with micro-buffers

摘要

The semiconductor module includes a plurality of memory die on a first side of a substrate and a plurality of buffer die on a second side of the substrate. Each of the memory die is disposed opposite and electrically coupled to one of the buffer die.

主权项

1. A semiconductor module comprising:
a substrate having first and second opposing sides; first and second memory dies mechanically coupled to the first side of the substrate adjacent to one another; a buffer die mechanically coupled to the first side of the substrate between the first and second memory dies; first and second interconnections of substantially the same first length, the first interconnection connecting the buffer die to the first memory die, and the second interconnection connecting the buffer die to the second memory die; and third and fourth memory dies mechanically coupled to the second side of the substrate; and third and fourth interconnections of substantially the same second length, the third interconnection connecting the buffer die to the third memory die, and the fourth interconnection connecting the buffer die to the fourth memory die.