发明名称 THE MODULAR CONSTRUCTION KIT OF IMPROVE FOR CIRCUIT ELEMENTS
摘要 <p>According to a construction kit for module type circuit elements disclosed in the present invention, individual circuit elements for forming an electronic circuit are formed in the shape of a module, a circuit diagram and the actual elements of the circuit elements can be intuitionally identified through an upper surface and a lower surface of a circuit element block module having the shape of module, user convenience is improved by coupling the circuit element block module with a lead line connection block module without using a soldering process or a wire connection process, a connection error and a malfunction of a port occurring in existing SMD or dip type circuit elements are prevented, and the learning of the electronic circuit elements can be improved by enhancing an intuitive learning approach of a learner.</p>
申请公布号 KR101413839(B1) 申请公布日期 2014.07.01
申请号 KR20120120317 申请日期 2012.10.29
申请人 发明人
分类号 G09B23/18;G09B25/02;H05K3/32 主分类号 G09B23/18
代理机构 代理人
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