| 发明名称 | Mold apparatus | ||
| 摘要 | The present disclosure relates to a mold apparatus, and according to an aspect of the present disclosure, there is provided a mold apparatus including a cavity mold comprising a cavity mold plate formed with a cavity at a front surface thereof and provided with a heating means at an inner portion thereof, and a cooling plate brought into contact with or separated from a rear surface of the cavity mold plate and provided with a cooling means at an inner portion thereof; and a core mold configured to determine the cavity together with the cavity mold plate, wherein the cooling plate is formed with at least two or more divided surfaces. | ||
| 申请公布号 | US8764433(B2) | 申请公布日期 | 2014.07.01 |
| 申请号 | US201213480962 | 申请日期 | 2012.05.25 |
| 申请人 | LG Electronics Inc. | 发明人 | Kim Jookwon;Lee Gyusang;Hwang Minkyu;Jun Hyunwoo;Jeong Seokjae;Kim Kyungdo |
| 分类号 | B29C45/73 | 主分类号 | B29C45/73 |
| 代理机构 | Ked & Associates, LLP | 代理人 | Ked & Associates, LLP |
| 主权项 | 1. A mold apparatus, comprising: a cavity mold comprising a cavity mold plate formed with a cavity at a front surface thereof and provided with a heater at an inner portion thereof, and a cooling plate movably installed in the cavity mold so as to be brought into contact with or separated from a rear surface of the cavity mold plate and provided with a cooler at an inner portion thereof; and a core mold configured to determine the cavity together with the cavity mold plate, wherein at least two or more cooling plates are provided in the cavity mold. | ||
| 地址 | Seoul KR | ||