发明名称 Integrated-inverter electric compressor
摘要 An integrated-inverter electric compressor whose grounding effect and grounding reliability are increased by reliably grounding an inverter device to a housing and in which the size the inverter device are reduced by simplifying the grounding structure is provided. The integrated-inverter electric compressor includes an inverter device provided in an inverter container on the outer circumference of a housing. The inverter device includes an inverter module formed by integrating a power-related metal substrate and a resin case and is provided with a control-related substrate on the upper surface of the inverter module; the resin case is integrated with mounting legs provided at a plurality of locations on the circumference; the mounting legs are grounded to the power-related metal substrate and the control-related substrate; and grounding terminals, which frame-ground the substrates to the housing, are insert-molded in such a manner that the grounding terminals are securable to the inverter container with screws.
申请公布号 US8764415(B2) 申请公布日期 2014.07.01
申请号 US200812230138 申请日期 2008.08.25
申请人 Mitsubishi Heavy Industries, Ltd. 发明人 Hattori Makoto;Niwa Kazuki;Nakano Koji;Nakagami Takashi;Takashige Takayuki;Toyama Koji
分类号 F04B17/00;F04B35/04 主分类号 F04B17/00
代理机构 Westerman, Hattori, Daniels & Adrian, LLP 代理人 Westerman, Hattori, Daniels & Adrian, LLP
主权项 1. An integrated-inverter electric compressor, comprising: a housing; an electric motor and a compressing mechanism inside the housing; an inverter container disposed on an outer circumference of the housing; and an inverter device, disposed inside of and separable from inside the inverter container, for supplying electric power to the electric motor by converting DC power from a high-voltage power source to three-phase AC power, the inverter device being a one piece inverter module comprising: a power-related metal substrate on which a semiconductor switching device is mounted; a control-related substrate on which a control and communication circuit having a device that operates at low-voltage is mounted, the control-related substrate located on an upper surface of the inverter module above the power-related metal substrate, a rectangular resin case surrounding the inverter module, the resin case integrated with mounting legs at four corner sections of the rectangular resin case, the resin case located outside an outer periphery of the power-related metal substrate and the control-related substrate, the mounting legs being secured to the inverter container with screws; a common grounding terminal integrally insert molded into at least one of the mounting legs located at an outside corner of the power-related metal substrate and the control related substrate, the common grounding terminal comprising a flat conductor branching from a through hole into a first terminal part and a second terminal part, the first terminal part extending to the power-related substrate and being electrically grounded to and structurally connected to the power-related metal substrate, and the second terminal part extending upwardly to and being electrically grounded to and structurally connected to the control-related substrate, the through-hole providing a passage for one of the screws to secure the inverter module to the inverter container; and a high-voltage source and high-voltage grounding pattern from the power-related metal substrate and a low-voltage source and a low-voltage grounding pattern from the control-related substrate both being grounded via respective capacitors through the common grounding terminal.
地址 Tokyo JP