SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

摘要

Provided are a semiconductor package and a manufacturing method thereof. The semiconductor package and the manufacturing method thereof form a magnetic particle layer in which magnetic particles are concentrated in a local portion of a protective layer and use the magnetic particle layer as an electromagnetic shielding part by applying a magnetic field to the protective layer which maintains a flow state and inducing the magnetic particles within the protective layer to move and gather by the magnetic field when the protective layer covering a semiconductor chip mounted on a package substrate is formed.