Solid-state imaging apparatus and manufacturing method thereof

摘要

A solid-state imaging apparatus and a manufacturing method of a solid-state imaging apparatus are provided. Metal wirings 102 and 103 are formed in an effective pixel region A and out-of effective pixel region B of a semiconductor substrate 100, and an etch stop layer 118 is formed over the metal wirings 102 and 103. Moreover, an insulating film 119 is formed on the etch stop layer 118, and another metal wiring 104 is formed on the insulating film 119 in the out-of effective pixel region B. Next, the insulating film 119 in the effective pixel region A is removed by using the etch stop layer 118, and interlayer lenses 105 are formed in the step in the effective pixel region A where the insulating film 119 is removed.

主权项

1. A solid-state imaging apparatus, comprising:
a first region in which a plurality of pixels each including a photoelectric conversion element are arranged; a second region including a peripheral circuit for readout from said plurality of pixels; each of said pixels having an interlayer lens arranged above said photoelectric conversion element; a color filter arranged above said interlayer lens; a lens arranged above said color filter; metal wiring layers arranged in said first region and said second region; and an insulating film, wherein a number of said metal wiring layers arranged in said first region is smaller than a number of said metal wiring layers arranged in said second region, an upper face and a lower face of said interlayer lens are provided between a height of an upper face of a first wiring layer of said metal wiring layers in said second region and a height of a lower face of a second wiring layer of said metal wiring layers in said second region, and provided within said first region, and said second wiring layer of said metal wiring layers in said second region is one layer above said first wiring layer of said metal wiring layers in said second region, and said insulating film is arranged between said upper face of said first wiring layer of said metal wiring layers in said second region and a lower face of said second wiring layer of said metal wiring layers in said second region, and is extended from said second region to said first region.