Post deposition treatments for CVD cobalt films

摘要

Embodiments of the invention provide methods for forming materials on a substrate used for metal gate and other applications. In one embodiment, a method includes forming a cobalt stack over a barrier layer disposed on a substrate by depositing a cobalt layer during a deposition process, exposing the cobalt layer to a plasma to form a plasma-treated cobalt layer during a plasma process, and repeating the cobalt deposition process and the plasma process to form the cobalt stack containing a plurality of plasma-treated cobalt layers. The method further includes exposing the cobalt stack to an oxygen source gas to form a cobalt oxide layer from an upper portion of the cobalt stack during a surface oxidation process and heating the remaining portion of the cobalt stack to a temperature within a range from about 300° C. to about 500° C. to form a crystalline cobalt film during a thermal annealing crystallization process.

主权项

1. A method for depositing materials on a substrate surface, comprising:
forming a cobalt stack over a barrier layer disposed on a substrate by:
depositing a cobalt layer during a deposition process;exposing the cobalt layer to a plasma to form a plasma-treated cobalt layer during a plasma process; andrepeating the deposition process and the plasma process to form the cobalt stack, the cobalt stack comprising a plurality of plasma-treated cobalt layers; and heating the cobalt stack to a crystallization temperature within a range from about 300° C. to about 500° C. to form a crystalline cobalt film from the cobalt stack during a thermal annealing crystallization process.