发明名称 |
Method of making an ultrahigh density vertical NAND memory device with shielding wings |
摘要 |
A method of making a monolithic three dimensional NAND string includes forming a stack of alternating layers of a first layer and a second layer over a substrate, where the first layer includes a conductive or semiconductor control gate material and the second layer includes an insulating material. The method also includes etching the stack to form at least one opening in the stack, selectively etching the first layer to form first recesses, forming a conductive or semiconductor liner having a clam shape in the first recesses, forming a blocking dielectric over the conductive or semiconductor liner in the first recesses, forming a plurality of discrete charge storage segments separated from each other in the first recesses over the blocking dielectric, forming a tunnel dielectric over a side wall of the discrete charge storage segments exposed in the at least one opening, and forming a semiconductor channel in the opening. |
申请公布号 |
US8765543(B2) |
申请公布日期 |
2014.07.01 |
申请号 |
US201314051627 |
申请日期 |
2013.10.11 |
申请人 |
SanDisk Technologies, Inc. |
发明人 |
Alsmeier Johann;Samachisa George |
分类号 |
H01L21/336 |
主分类号 |
H01L21/336 |
代理机构 |
The Marbury Law Group PLLC |
代理人 |
The Marbury Law Group PLLC |
主权项 |
1. A method of making a monolithic three dimensional NAND string, comprising:
forming a stack of alternating layers of a first layer and a second layer over a substrate, wherein the first layer comprises a conductive or semiconductor control gate material and wherein the second layer comprises an insulating material; etching the stack to form at least one opening in the stack; selectively etching the first layer to form first recesses; forming a conductive or semiconductor liner in the first recesses, the conductive or semiconductor liner having a clam shape; forming a blocking dielectric over the conductive or semiconductor liner in the first recesses; forming a plurality of discrete charge storage segments separated from each other in the first recesses over the blocking dielectric; forming a tunnel dielectric over a side wall of the discrete charge storage segments exposed in the at least one opening; and forming a semiconductor channel in the at least one opening. |
地址 |
Plano TX US |