发明名称 Method of fabricating semiconductor compound
摘要 In order to realize a method for manufacturing a semiconductor compound which can replace titanium dioxide and has superior physical properties rapidly and safely obtained in operational processes, and a material manufactured thereby, the present invention provides the method for manufacturing the semiconductor compound. The method includes a step of providing a mixed solution of titanium dioxide, a cadmium precursor, 3-mercaptopropionic acid, and water and a step of forming a semiconductor compound combined with titanium dioxide and cadmium sulfide by irradiating the mixed solution with microwaves. [Reference numerals] (S100) Step of providing a titanium dioxide aqueous solution; (S200) Step of forming a cadmium dithiol complex; (S300) Step of manufacturing a mixed solution between the cadmium dithiol complex and the titanium dioxide aqueous solution; (S400) Step of irradiating the mixed solution with microwaves; (S500) Step of obtaining and drying determined nanocrystal in which cadmium sulfide and titanium dioxide are combined
申请公布号 KR101413165(B1) 申请公布日期 2014.07.01
申请号 KR20120114629 申请日期 2012.10.16
申请人 发明人
分类号 H01B1/00;H01L21/26 主分类号 H01B1/00
代理机构 代理人
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