ADHESIVE TAPE FOR MANUFACTURING ELECTRONIC COMPONENT

摘要

The present invention relates to an adhesive tape for manufacturing an electronic component, and more specifically, to an adhesive tape for manufacturing an electric component capable of satisfying all requirement properties of lamination process conditions, and improving limitations of adhesive residues and sealing resin leakage of the adhesive tape used in the existing electronic component manufacturing processes. To this end, the adhesive tape for manufacturing an electronic component is characterized by comprising: a heat resistant base; a reinforcement layer formed on one side of the heat resistant base; and an adhesive layer formed on the reinforcement layer.