发明名称 |
Self-aligned implants to reduce cross-talk of imaging sensors |
摘要 |
A method of preparing self-aligned isolation regions between two neighboring sensor elements on a substrate. The method includes patterning an oxide layer to form an opening between the two neighboring sensor elements on the substrate. The method further includes performing a first implant to form a deep doped region between the two neighboring sensor elements and starting at a distance below a top surface of the substrate. The method further includes performing a second implant to form a shallow doped region between the two neighboring sensor elements, wherein a bottom portion of the shallow doped region overlaps with a top portion of the deep doped region. |
申请公布号 |
US8766406(B2) |
申请公布日期 |
2014.07.01 |
申请号 |
US201313736380 |
申请日期 |
2013.01.08 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Fu Shih-Chi;Tzeng Kai;Lu Wen-Chen |
分类号 |
H01L21/331;H01L21/70 |
主分类号 |
H01L21/331 |
代理机构 |
Lowe Hauptman & Ham, LLP |
代理人 |
Lowe Hauptman & Ham, LLP |
主权项 |
1. An image sensor comprising:
a substrate; two neighboring sensor elements in the substrate; a deep doped region in the substrate between the two neighboring sensor elements and starting a distance below a top surface of the substrate; a shallow doped region in the substrate between the two neighboring sensor elements, wherein a bottom portion of the shallow doped region overlaps with a top portion of the deep doped region; and a shallow trench isolation (STI) feature, wherein the shallow doped region extends from a top surface of the substrate through the STI feature. |
地址 |
TW |