发明名称 Self-aligned implants to reduce cross-talk of imaging sensors
摘要 A method of preparing self-aligned isolation regions between two neighboring sensor elements on a substrate. The method includes patterning an oxide layer to form an opening between the two neighboring sensor elements on the substrate. The method further includes performing a first implant to form a deep doped region between the two neighboring sensor elements and starting at a distance below a top surface of the substrate. The method further includes performing a second implant to form a shallow doped region between the two neighboring sensor elements, wherein a bottom portion of the shallow doped region overlaps with a top portion of the deep doped region.
申请公布号 US8766406(B2) 申请公布日期 2014.07.01
申请号 US201313736380 申请日期 2013.01.08
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Fu Shih-Chi;Tzeng Kai;Lu Wen-Chen
分类号 H01L21/331;H01L21/70 主分类号 H01L21/331
代理机构 Lowe Hauptman & Ham, LLP 代理人 Lowe Hauptman & Ham, LLP
主权项 1. An image sensor comprising: a substrate; two neighboring sensor elements in the substrate; a deep doped region in the substrate between the two neighboring sensor elements and starting a distance below a top surface of the substrate; a shallow doped region in the substrate between the two neighboring sensor elements, wherein a bottom portion of the shallow doped region overlaps with a top portion of the deep doped region; and a shallow trench isolation (STI) feature, wherein the shallow doped region extends from a top surface of the substrate through the STI feature.
地址 TW