| 摘要 |
<p>The present invention relates to a double-sided adhesive film capable of preventing the adhesion and electrical interference between laminated dies and ensuring a wire space. The present invention relates to a thermosetting double-sided adhesive film used in a lamination chip scale package (CSP) and a method of fabricating the same, capable of representing superior feeding properties in a film cutting work, superior heat resistance and superior adhesive strength resulting from taping and die-adhesion and preventing the failure of die cracks and the delamination of the interfacial surface resulting from moisture absorption of an internal package under high-temperature work. The double-sided adhesive film according to the present invention is used to bond dies including a polyimide film coated with an adhesive layer on both sides thereof. The adhesive layer includes an NBR containing a carboxyl group, an epoxy resin, a phenol resin, and a curing agent. A protective film is laminated on the top surface of the adhesive layer. The total thickness of the adhesive layer is 10 to 30% of the whole thickness, except for the thickness of the protective film. According the double-sided adhesive film for bonding the semiconductor die according to the present invention, the superior feeding properties according to the film supply can be represented in the state that the heat resistance and the adhesive strength of the double-sided adhesive film are maintained at the same level as that of the conventional double-sided adhesive film.</p> |
