| 摘要 |
<p>[Problem] To provide a single wafer-type chemical polishing device capable of performing a chemical polishing treatment on a glass substrate without the use of a jig. [Solution] A chemical polishing device (10) is provided with at least a conveyance unit and a polishing treatment unit. The conveyance unit is provided with a plurality of conveyance rollers (50) that are configured so as to support the bottom surface of a glass substrate (100) while conveying said substrate in a horizontal direction. The polishing treatment unit is provided with first to fourth treatment chambers (16, 18, 20, 22) and first to third relay sections (28, 30, 32). Each of the first to fourth treatment chambers (16, 18, 20, 22) are configured to spray the glass substrate with a chemical polishing liquid having the same composition. The first to third relay section (28, 30, 32) are configured so as to connect each of the treatment chambers. Each of the first to fourth treatment chambers (16, 18, 20, 22) has a spray nozzle that is swingable in a direction orthogonal to the conveyance direction of the glass substrate (100).</p> |
