| 发明名称 |
Substrate with bond fingers |
| 摘要 |
A flip chip mounting board includes a substrate having a top surface and a plurality of generally parallel, longitudinally extending, laterally spaced apart bond fingers are formed on the top surface. Each of the plurality of bond fingers has a first longitudinal end portion and a second longitudinal end portion. A first strip of laterally extending solder resist material overlies the first longitudinal end portions of the bond fingers. The first strip has an edge wall with a plurality of longitudinally projecting tooth portions separated by gaps with a longitudinally extending tooth portion being aligned with every other one of the bond fingers. Adjacent bond fingers have first end portions covered by different longitudinal lengths of solder resist material. |
| 申请公布号 |
US8766461(B1) |
申请公布日期 |
2014.07.01 |
| 申请号 |
US201313743213 |
申请日期 |
2013.01.16 |
| 申请人 |
Texas Instruments Incorporated |
发明人 |
Partosa Raymond;Bautista Jesus Bajo;Baello James Raymond;Samson Roxanna Bauzon |
| 分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
Shaw Steven A.;Brady, III Wade James;Telecky, Jr. Frederick J. |
| 主权项 |
1. A flip chip mounting board comprising:
a substrate having a top surface; a plurality of generally parallel, longitudinally extending, laterally spaced apart bond fingers formed on said top surface, each of said plurality of bond fingers having a first longitudinal end portion and a second longitudinal end portion; and a first strip of laterally extending solder resist material overlying said first longitudinal end portions of said bond fingers, said first strip comprising an edge wall having a plurality of longitudinally projecting tooth portions separated by gaps with a longitudinally extending tooth portion being aligned with every other one of said bond fingers whereby adjacent ones of said bond fingers have first end portions covered by different longitudinal lengths of solder resist material. |
| 地址 |
Dallas TX US |
