Laser irradiating device, laser irradiating method and manufacturing method of semiconductor device

摘要

An object of the present invention is to provide a method and a device for constantly setting the energy distribution of a laser beam on an irradiating face, and uniformly irradiating the laser beam to the entire irradiating face. Further, another object of the present invention is to provide a manufacturing method of a semiconductor device including this laser irradiating method in a process. Therefore, the present invention is characterized in that the shapes of plural laser beams on the irradiating face are formed by an optical system in an elliptical shape or a rectangular shape, and the plural laser beams are irradiated while the irradiating face is moved in a first direction, and the plural laser beams are irradiated while the irradiating face is moved in a second direction and is moved in a direction reverse to the first direction. The plural laser beams may be irradiated while the irradiating face is moved in the first direction, and the plural laser beams may be irradiated while the irradiating face is moved in the direction reverse to the first direction, and the irradiating face may be also moved in the second direction.

主权项

1. A laser irradiating device comprising: a plurality of lasers configured to emit a plurality of laser beams; an irradiating face slantingly arranged with respect to the plurality of laser beams; an isolator configured to remove return light of the plurality of laser beams; means for forming shapes of the plurality of laser beams on the irradiating face in an elliptical shape; and means for moving irradiating positions of the plurality of laser beams on the irradiating face in a first direction and a direction reverse to the first direction, and moving the irradiating positions of the plurality of laser beams on the irradiating face in a second direction, wherein each of the plurality of lasers is configured to irradiate to emit each different region of the irradiating face at a time, wherein each of the plurality of lasers is configured to emit a laser beam slantingly with respect to a vertical direction of the irradiating face in the middle of the laser beam, and wherein each of incident angles φ of the plurality of laser beams to the irradiating face is the same or satisfy φ≧arcsin (W/2d) when widths of the plurality of laser beams are set to W and a thickness of a substrate is set to d—so that no interference is caused unless incident light and reflected light on a rear surface of the substrate are overlapped.