发明名称 Methods of patterning a material on polymeric substrates
摘要 A method of patterning a first material on a polymeric substrate is described. The method includes providing a polymeric film substrate having a major surface with a relief pattern including a recessed region and an adjacent raised region, depositing a first material onto the major surface of the polymeric film substrate to form a coated polymeric film substrate, forming a layer of a functionalizing material selectively on the raised region of the coated polymeric film substrate to form a functionalized raised region and an unfunctionalized recessed region, and etching the first material from the polymeric substrate selectively from the unfunctionalized recessed region.
申请公布号 US8764996(B2) 申请公布日期 2014.07.01
申请号 US200611550542 申请日期 2006.10.18
申请人 3M Innovative Properties Company 发明人 Frey Matthew H.;Nguyen Khanh P.
分类号 C23F1/02;H05K3/06;H05K3/00;H05B3/84;H05K9/00;H05K1/03 主分类号 C23F1/02
代理机构 代理人 Allen Gregory D.;Pishko Adrian L.
主权项 1. A method of patterning a first material on a polymeric substrate comprising: providing a transparent polymeric film substrate having a major surface with a relief pattern comprising a recessed region and an adjacent raised region, wherein the recessed region has a floor and sidewalls; depositing a first material onto the major surface of the polymeric film substrate to form a coated polymeric film substrate, wherein the depositing a first material comprises depositing a metal onto the polymeric film substrate; forming a layer of a functionalizing material selectively on the raised region of the coated polymeric film substrate to form a functionalized raised region and an unfunctionalized recessed region, wherein the functionalizing material is a self-assembled monolayer selectively onto the raised region and the self-assembled monolayer comprises a chemical species selected from the group consisting of organosulfur compounds, silanes, phosphonic acids, benzotriazoles, and carboxylic acids, wherein forming comprises unwinding the coated polymeric film substrate from a support and winding the coated polymeric film substrate onto a support; and etching the first material from the polymeric substrate selectively from the floor and sidewalls of the unfunctionalized recessed region, forming a first material patterned polymeric substrate.
地址 St. Paul MN US