| 摘要 |
Disclosed are an apparatus for grinding a wafer edge which accurately controls a shape in grinding the wafer edge, and a method for grinding a wafer edge. An apparatus for grinding a wafer edge according to an embodiment includes a wafer chuck which supports a wafer; and a grinding unit which is arranged at the side of the wafer chuck and includes a grinding pad which touches the edge of the wafer and a moving part which moves and fixes the grinding pad. A method for grinding a wafer edge according to an embodiment includes a step of mounting a wafer on a wafer chuck; a step of arranging multiple grinding pads to touch a wafer along the edge of the wafer; and a step of grinding the edge of the wafer by rotating the wafer chuck. |
