| 发明名称 |
METHOD FOR ENCAPSULATING AN ELECTRONIC COMPONENT USING A PLASTIC OBJECT, AND PLASTIC OBJECT |
| 摘要 |
<p>THE INVENTION RELATES TO A METHOD FOR ENCAPSULATING AN ELECTRONIC COMPONENT (11) IN A MOULD BY THE PROCESSING STEPS OF: PLACING THE COMPONENT INTO A MOULD CAVITY (33), FEEDING ENCAPSULATING MATERIAL, AND CURING THE ENCAPSULATING MATERIAL, WHEREIN THE ELECTRONIC COMPONENT (11) IS SHIELDED BY AN OBJECT. THE INVENTION ALSO RELATES TO AN OBJECT. THE MOST SUITABLE DRAWING IS</p> |
| 申请公布号 |
MY151694(A) |
申请公布日期 |
2014.06.30 |
| 申请号 |
MY2005PI03504 |
申请日期 |
2005.07.29 |
| 申请人 |
BESI NETHERLANDS B.V. |
发明人 |
DE VRIES, FRANCISCUS BERNARDUS ANTONIUS;GAL, WILHELMUS GERARDUS JOZEF |
| 分类号 |
H01L21/68 |
主分类号 |
H01L21/68 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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