METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor element capable of obtaining semiconductor elements to each of which a conductive connection sheet is adhered with a good position accuracy as a block, and to provide a method of manufacturing a semiconductor device using the conductive connection sheet that enables positioning of a terminal provided in the semiconductor element and a terminal provided in an opposed electronic component with ease and excellent position accuracy when a metal material is agglomerated between the terminal provided in the semiconductor element and the terminal provided in the opposed electronic component to connect between the terminals.SOLUTION: A method of manufacturing a semiconductor element includes the steps of: adhering a conductive connection sheet 1 onto a surface side where a terminal (a first terminal) 21 of a semiconductor wafer 100 in which semiconductor chips (semiconductor elements) 20 are formed is provided by using positioning marks (first positioning marks) 455 formed on the semiconductor wafer 100 and defective parts (first defective parts) 121 lacking a metal layer 12; and obtaining the semiconductor chips 20 to each of which the conductive connection sheet 1 is adhered by individualizing the semiconductor wafer 100.