| 摘要 |
PROBLEM TO BE SOLVED: To provide a hot blast jetting device capable of simultaneously melting soft solder on both sides of an electronic part such as a tip, in the present invention.SOLUTION: The hot blast jetting device on the present invention comprises a cylindrical part, a first blowout pipe and a blowout part. The cylindrical part comprises a sidewall for providing a storage space for storing a hot blast and a separation plate installed in the sidewall. The blowout part comprises a first vent pipe and a second vent pipe slidably installed in the first vent pipe in the parallel direction to the separation plate, and the upper end of the first blowout pipe and the first vent pipe is communicated with a part existing above the separation plate of the storage space by inserting the separation plate, and the bottom end of the first blowout pipe and the second vent pipe becomes a blowout port. |
