发明名称 HEAT PUMP DEVICE FOR VEHICLE
摘要 <p>PROBLEM TO BE SOLVED: To provide a heat pump device for a vehicle capable of properly cooling an element of a driving circuit without degrading a degree of freedom in arrangement of the element, and having a structure not complicating a structure for allowing a cooling medium of the driving circuit to flow.SOLUTION: A heat pump device for a vehicle includes an accommodating portion for accommodating a driving circuit of an electric compressor and capable of releasing generated heat of the driving circuit, a high temperature-side water-refrigerant hot heat exchanger exchanging heat between a first cooling liquid for transporting heat and a high-temperature high-pressure refrigerant discharged from the electric compressor, a low temperature-side water-refrigerant heat exchanger exchanging heat between a second cooling liquid for transporting cold heat and a low-temperature low-pressure refrigerant introduced to the electric compressor, a first passage disposed along a first face of the accommodating portion, and a second passage disposed along a second face of the accommodating portion different from the first face. The first cooling liquid flows in the first passage to cool the first face, and the second cooling refrigerant flows in the second passage to cool the second face.</p>
申请公布号 JP2014118856(A) 申请公布日期 2014.06.30
申请号 JP20120273354 申请日期 2012.12.14
申请人 PANASONIC CORP 发明人 TSUKAHARA HIROTOMO;FUJISAWA TORU;WATANABE YUTAKA;ITANI SATORU
分类号 F04B39/00;B60H1/22;F04B39/06 主分类号 F04B39/00
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