发明名称 MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD MOUNTED WITH THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a multilayer ceramic capacitor excellent in capacity and packaging density, and a circuit board mounted with the same.SOLUTION: A multilayer ceramic capacitor comprises: a ceramic main body including a first main surface and a second main surface which are opposed to each other, a first lateral surface and a second lateral surface which are opposed to each other, and a first end surface and a second end surface which are opposed to each other; a first internal electrode and a second internal electrode including a region overlapped each other and a lead-out part to which the overlapped region is exposed on a surface of the ceramic main body; an insulator layer which is formed so as to cover the overlapped region of the lead-out part exposed on the surface of the ceramic main body; and a first external electrode and a second external electrode which are formed on the surface of the ceramic main body where the insulator layer is formed, and which are electrically connected with the first internal electrode and the second internal electrode. When A is a thickness of the insulator layer from the surface, B is a thickness of the first external electrode and the second external electrode from the surface, the following formula is satisfied: 1.10≤B/A≤1.30.
申请公布号 JP2014120748(A) 申请公布日期 2014.06.30
申请号 JP20130002381 申请日期 2013.01.10
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 LEE KI YONG;KIM SANG HYUK;LEE MIN GON;KANG SUNG HYUNG;CHOI JAE YEOL
分类号 H01G4/30;H01G4/12;H01G4/232 主分类号 H01G4/30
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