METHOD OF MANUFACTURING ULTRASONIC PROBE, ULTRASONIC PROBE, AND ULTRASONIC DIAGNOSTIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To suppress damage while ensuring operation reliability, when assembling an ultrasonic probe by using a chip in which a capacitance type ultrasonic transducer is formed.SOLUTION: In a semiconductor substrate where a capacitance type ultrasonic transducer (CMUT)is formed on a first principal surface, a protective film is formed (2) on the surface of the ultrasonic transducer formed on the first principal surface of the semiconductor substrate, the semiconductor substrate is thinned (3) by polishing the second principal surface of the semiconductor substrate opposing the first principal surface, ultrasonic transducer chips are diced (4) from the semiconductor substrate, an acoustic material is provided (5) on a surface facing the surface where the ultrasonic transducer is formed, and then the protective film formed on the surface of the ultrasonic transducer is removed (6).