| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for granular semiconductor sealing having low wire deformation rate, less resin leak and excellent in moldability, and to provide a semiconductor device made by compression molding.SOLUTION: There is provided a resin composition for granular semiconductor sealing containing (A) a biphenyl type epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) spherical silica as essential components, (D) spherical silica of 80 mass% or more and less than 95 mass% is contained in the resin composition, and its particle size distribution is in the prescribed range, and skewness is 0 or more and less than 2.5, and kurtosis is 0 or more and less than 5 in histogram of a brightness value obtained from a molten surface after a heating treatment. There is also provided a semiconductor device obtained by using the resin composition. |
